Marking lasers XENO 4, XENO 4S
New fiber lasers with 20, 30 or 50 Watt output power

High beam quality and high pulse peak powers

The performance and quality of markings mainly depend from the output power and the laser beam focus.

cab XENO 4 marking lasers are diode-pumped and air-cooled. They have high beam quality and high pulse peak powers. Laser sources are provided with 20, 30 and 50 Watt.

Different plano-spherical lenses enable marking in fields from 69 x 69 mm to 290 x 290 mm.

Marking is possible on plastics, metals and painted surfaces.

XENO 4 marking lasers consist of two units: The control unit has the beam source integrated, whereas the scan head is connected with the beam source via a fiber. It can be assembled in any orientation.

The integrated focus finder simplifies workpiece positioning.

cab marking lasers XENO 4 represents

a compact scan head,
high operation speeds,
integrated focus finding,
shifting the marking plane quickly,
shifting the focus throughout height differences up to 140 mm,
Industry 4.0,
TCP/IP control and monitoring

The control unit and the beam source are incorporated in a 19" rack.

vergrößern

Shifting the focus with XENO 4S

By shifting the focus, XENO 4S can within fractions of a second effortlessly compensate height differences on a component.

By mechanical unit adjustment, even complex markings are possible on different levels of a component without loss of cycle time.

A control unit calculates the respective layout scaling. Depending from the plano-spherical lens in use, shifting is possible up to ±70 mm.

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Marking lasers XENO 4

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Marking laser	XENO 4 / 20	XENO 4 / 30	XENO 4 / 50	XENO 4 / 20	XENO 4 / 30	XENO 4 / 50
	1.1 - 1.12
Beam source	Ytterbium fiber laser, pulsed, air-cooled
cw output power up to W	20	30	50	20	30	50
Pulse energy mJ	1
Wave length nm	1,064
Beam quality M²	< 1.8
Pulse width ns	< 120
Pulse repetition frequency kHz	20 - 60	30 - 60	50 - 100	20 - 60	30 - 60	50 - 100
Connection cable m	2.5

Plano-spherical lens on	XENO 4				XENO 4 S
Lens Type	100.2	160.2	254.2	420.2	160.2	254.2
Operation distance mm	149 ± 4	210 ± 8	310 ± 8	549 ± 20	310 ± 8	310 ± 8
Marking field mm	69 x 69	112 x 112	180 x 180	290 x 290	100 x 100 - 135 x 135	160 x 160 - 250 x 250
Spot diameter μm	~25	~35	~50	~85	~35	~50
= Resolution dpi	1,000	725	500	300	725	500
Scan head
Assembly	horizontal / vertical
Marking speed mm/s	~5,000
Shift of focus mm	-		-		±35	±70
Speed of shift of focus mm/ms	-		-		0.5	0.3

Pilot laser
Wave length nm	650
cw output power	< 1
Electronics
Processor 32 bit clock rate MHz	600
Main memory (RAM) MB	256
Data memory (Flash) MB	512
Extension (Flash)	USB memory stick
Dimensions and weights	Rack 4 height units 19“
Control unit W x H x D mm	420 x 178 x 420
Control unit Weight kg	16
Scan head W x H x D mm	99 x 135 x 205			99 x 155 x 260
Scan head Weight kg	3			4
Operation panel
Key switch	Beam source ON/OFF
Buttons Pilot laser / focus finder	ON/OFF
Buttons Shutter open	open / close
Display Emission	Beam source in operation
Display Laser error	Beam source error
Display Ready	Beam source ready
Display Power	Power supply ON
Display Pilot laser / focus finder	ON
Display Shutter open	Safety lock open
Connections Service	USB Mini
Connections Data memory	USB
Operating data
Power supply	100-240 VAC, 50/60 Hz
Power switch	ON/OFF
Power consumption Standby W	65
Power consumption up to W	200	200	350	200	200	350
Approvals	CE, FCC Class A
Laser protection class EN60825-1
Laser protection class Beam source	Class 4
Laser protection class Pilot laser	Class 2

Dimensional drawings and more technical data see product catalog marking lasers.

Interfaces

Interfaces providing process control and monitoring

1 Ethernet 10/100 Mbit/s to connect a PC. As delivered, the device has been configured with an IP address or in DHCP mode.

2 Ethernet 10/100 Mbit/s to connect peripheral devices. Bidirectional data transfer from and to end devices

3 + 4 2 x RS232 C to connect peripheral devices. Bidirectional data transfer from and to end devices

5 Digital I/O control and monitoring. Provided are 8 inputs and outputs, freely programmable. Circuit protected according to IEC 61131-2

6 Remote laser switch-on and control

7 Interlock / E-stop to integrate to external safety circuits and connect an external E-stop

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Marking lasers XENO 4

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Marking laser accessories

Plano-spherical lenses F-Theta XENO series

The laser marking system XENO 1 is available with two different lenses.
The smaller the marking field, the higher the resolution.

Plano-spherical lens	100.2	160.2	254.2	420.2
To be used with	XENO 4	XENO 1 XENO 3 XENO 4/4S	XENO 1 XENO 4/4S	XENO 4
Operating distance XENO 1 mm	149 ± 4	210 ± 8	310 ± 8	549 ± 20
Marking field mm	69 x 69	112 x 112	180 x 180	290 x 290
Spot diameter μm	~25	~35	~50	~85
≙ Resolution dpi	1.000	725	500	300
Shift of focus with XENO 4S mm	-	± 35	± 70	-
Shift of focus speed ms/mm	-	0.5	0.3	-

1 Operating distance

Protective glass for F-Theta

It is mounted on the plano-spherical lens F-Theta and can be replaced in case of a damage.

Protective glass for F-Theta 100 160 254 420

Outside diameter mm 80 75 75 114

Protective glass for F-Theta	100	160	254	420
Outside diameter mm	80	75	75	114

Linear axes Z400, Z200

They allows precisely positioning the scan head.

Linear axis	Z400	Z200
Traversing distance mm	440	200
Position accuracy mm	0.05	0.05
Repetetive accuracy mm	±0.05	±0.05
Traversing speed max. mm/s	60	20
Dimensions W x H x D mm	110 x 840 x 220	110 x 510 x 220
Load capacity kg	10	7
Weight kg	16	9

Axis controller 2S

It allows positioning of the linear and rotary axes via the RS232 or digital I/O interface.

Axis controller	2S
Dimensions W x H x D mm	150 x 110 x 25
Interfaces for Z and rotary axis Interfaces for Digital I/O Interfaces for RS232	for manual operation for automatic operation
Power supply	24 VDC
Connecting cable for axis controller	2S
Length mm	3,000

Extraction and filter device AF5

Laser marking processes produce poisonous dusts and gases. The extraction and filter device protects the health of the operators and prevents both the laser area and lens from contamination. At this, it also ensures that the laser power maintains. The air from the working area is extracted by a highly performant turbine via a flexible hose.

The pollutants resp. dusts are separated by the pre-filter and the filter for suspended particles. Gaseous pollutants are absorbed by the active carbon filter. Cleaned air is then returned to the environment.

The extraction and filter device has a modular design, filters are easy to exchange.

More information

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Marking lasers XENO 4

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Documentation

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Catalogs

Title	Format	Version	Last change	Language
Laser marking systems	PDF - 2.69 MB	03/2021	08/04/2021	English

Assembly Instructions

Title	Format	Version	Last change	Language
Assembly Instructions Marking Laser XENO 4	PDF - 4.78 MB	08/2019	11/12/2019	English

Programming

Title	Format	Version	Last change	Language
PLC Programmer's Guide: cab XENO 4 / XENO 4S - Remote API Interface	PDF - 3.74 MB	02/2020	10/02/2020	English
cab FL+ / XENO 4 remote API program example Siemens	ZIP - 4.56 MB	03/2016	12/03/2021	–

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XENO_4_4S_Rack_Scanhead.zip (3.37 MB)
XENO_4_Adapter_Plate_5528441.zip (31 KB)
XENO_4S_Adapter_Plate_5528555.zip (30 KB)

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Software & Drivers

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Software

Title	Format	Version	Last change	Language
cabLaseEditor (TCP/IP)	ZIP - 159.74 MB	5.2.2.1 i03	24/03/2021	–

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Marking lasers XENO 4, XENO 4S
New fiber lasers with 20, 30 or 50 Watt output power